Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced Wafers
Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced Wafers
John H Lau, Cheng-Ta Ko, Tzvy-Jang Tseng, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Eagle Lin, Leo Chang, Hsing Ning Liu, Curry Lin, David Cheng, Winnie Lu,
Lau, John H, Cheng-Ta Ko, Tzvy-Jang Tseng, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, et al. 2020. “Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced Wafers.” IMAPSource Proceedings 2020 (1): 57–66. https://doi.org/10.4071/2380-4505-2020.1.000057.