Vol. 2011, Issue 1, 2011January 01, 2011 EDT
The Mechanism of The Die Crack in exposed Pad Quad Flat Package(ePad QFP) with Large Die due to Die-attach Adhesive with high modulus
The Mechanism of The Die Crack in exposed Pad Quad Flat Package(ePad QFP) with Large Die due to Die-attach Adhesive with high modulus
Jin-Ho Kim, Dong-Nam Kim, Young-Chul Jo, Nam-Yong Kim, Seung-Geun Kang, Byung-Ju Lee, Dal-Soo Kim, Tea-Seob Yun, Sung-Jun Kim,
Kim, Jin-Ho, Dong-Nam Kim, Young-Chul Jo, Nam-Yong Kim, Seung-Geun Kang, Byung-Ju Lee, Dal-Soo Kim, Tea-Seob Yun, and Sung-Jun Kim. 2011. “The Mechanism of The Die Crack in Exposed Pad Quad Flat Package(ePad QFP) with Large Die Due to Die-Attach Adhesive with High Modulus.” IMAPSource Proceedings 2011 (1): 711–18. https://doi.org/10.4071/isom-2011-WP2-Paper4.