Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Molding Recipe Study for MUF Solder Crack Improvement
Scott Chen
,
Leander Liang
,
Pallas Hsu
,
Tim Tsai
,
Mason Liang
,
Michael Shy
,
Molded underfill
Solder crack
Mold transfer time
Mold temperature
•
https://doi.org/10.4071/2380-4505-2018.1.000121
IMAPSource Conference Papers
Chen, Scott, Leander Liang, Pallas Hsu, Tim Tsai, Mason Liang, and Michael Shy. 2018. “Molding Recipe Study for MUF Solder Crack Improvement.”
IMAPSource Proceedings
2018 (1): 121–24.
https://doi.org/10.4071/2380-4505-2018.1.000121
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats