Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

S. Kaessner; M.G. Scheibel; S. Behrendt; B. Boettge; K.G. Nickel

doi:10.4071/2380-4505-2018.1.000425

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Kaessner, S., M.G. Scheibel, S. Behrendt, B. Boettge, and K.G. Nickel. 2018. “Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging.” IMAPSource Proceedings 2018 (1): 425–33. https://doi.org/10.4071/2380-4505-2018.1.000425.

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