Reliability Assessment of Flip-chip Assembly of Al Bumps

Hidekazu TANISAWA; Kohei HIYAMA; Takeshi ANZAI; Hiroki TAKAHASHI; Yoshinori MURAKAMI; Shinji SATO; Kinuyo WATANABE; Fumiki KATO; Hiroshi SATO

doi:10.4071/isom-TP46

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TANISAWA, Hidekazu, Kohei HIYAMA, Takeshi ANZAI, Hiroki TAKAHASHI, Yoshinori MURAKAMI, Shinji SATO, Kinuyo WATANABE, Fumiki KATO, and Hiroshi SATO. 2014. “Reliability Assessment of Flip-Chip Assembly of Al Bumps.” IMAPSource Proceedings 2014 (1): 301–6. https://doi.org/10.4071/isom-TP46.

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