Flip chip reliability and intermetallic compounds for SIP module

Adrien Morard; Jean-Christophe Riou; Gabriel Pares

doi:10.4071/2380-4505-2018.1.000029

Morard, Adrien, Jean-Christophe Riou, and Gabriel Pares. 2018. “Flip Chip Reliability and Intermetallic Compounds for SIP Module.” IMAPSource Proceedings 2018 (1): 29–36. https://doi.org/10.4071/2380-4505-2018.1.000029.

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Flip chip reliability and intermetallic compounds for SIP module

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