Evaluation of die to organic laminate to PCB interconnects up to 50GHz

Selaka Bulumulla; Koushik Ramachandran

doi:10.4071/2380-4505-2019.1.000223

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Bulumulla, Selaka, and Koushik Ramachandran. 2019. “Evaluation of Die to Organic Laminate to PCB Interconnects up to 50GHz.” IMAPSource Proceedings 2019 (1): 223–27. https://doi.org/10.4071/2380-4505-2019.1.000223.

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