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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Evaluation of die to organic laminate to PCB interconnects up to 50GHz
Selaka Bulumulla
,
Koushik Ramachandran
,
BGA packaging
flip chip
organic laminate
wire bond
•
https://doi.org/10.4071/2380-4505-2019.1.000223
IMAPSource Conference Papers
Bulumulla, Selaka, and Koushik Ramachandran. 2019. “Evaluation of Die to Organic Laminate to PCB Interconnects up to 50GHz.”
IMAPSource Proceedings
2019 (1): 223–27.
https://doi.org/10.4071/2380-4505-2019.1.000223
.
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