ISSN 2380-4505
Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Evaluation of die to organic laminate to PCB interconnects up to 50GHz
Evaluation of die to organic laminate to PCB interconnects up to 50GHz
Bulumulla, Selaka, and Koushik Ramachandran. 2019. “Evaluation of Die to Organic Laminate to PCB Interconnects up to 50GHz.” IMAPSource Proceedings 2019 (1): 223–27. https://doi.org/10.4071/2380-4505-2019.1.000223.