Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Si Vapor Chamber Integrated with Through Silicon Via for 3D Packaging
Si Vapor Chamber Integrated with Through Silicon Via for 3D Packaging
Taniguchi, Jun, Takeshi Shioga, and Yoshihiro Mizuno. 2013. “Si Vapor Chamber Integrated with Through Silicon Via for 3D Packaging.” IMAPSource Proceedings 2013 (1): 552–57. https://doi.org/10.4071/isom-2013-WA51.
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