Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection
Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection
Chun-Hsien Chien, Chien-Chou Chen, Wen-Liang Yeh, Wei-Ti Lin, Cheng-Hui Wu, Fu-Yang Chen, Yi-Cheng Lin, Po-Chiang Wang, Jeng-Ting Li, Bo Cheng Lin, Yu-Hua Chen, Tzyy-Jang Tseng,
Chien, Chun-Hsien, Chien-Chou Chen, Wen-Liang Yeh, Wei-Ti Lin, Cheng-Hui Wu, Fu-Yang Chen, Yi-Cheng Lin, et al. 2019. “Study Photo Imagable Dielectric (PID) and Non-PID on Process, Fabrication and Reliability by Using Panel Glass Substrate for next Generation Interconnection.” IMAPSource Proceedings 2019 (1): 216–22. https://doi.org/10.4071/2380-4505-2019.1.000216.