3D SiP Assembly and Reliability for Glass Substrate with Through Vias

Ra-Min Tain; Dyi-Chung Hu; Kai-Ming Yang; Yu-Hua Chen; Jui-Tang Chen; De-Shiang Liu; Chen-Hao Lin

doi:10.4071/isom-2016-WP22

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Tain, Ra-Min, Dyi-Chung Hu, Kai-Ming Yang, Yu-Hua Chen, Jui-Tang Chen, De-Shiang Liu, and Chen-Hao Lin. 2016. “3D SiP Assembly and Reliability for Glass Substrate with Through Vias.” IMAPSource Proceedings 2016 (1): 282–87. https://doi.org/10.4071/isom-2016-WP22.

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