3D SiP Assembly and Reliability for Glass Substrate with Through Vias

Tain, Ra-Min, Dyi-Chung Hu, Kai-Ming Yang, Yu-Hua Chen, Jui-Tang Chen, De-Shiang Liu, and Chen-Hao Lin. 2016. “3D SiP Assembly and Reliability for Glass Substrate with Through Vias.” IMAPSource Proceedings 2016 (1): 282–87. https:/​/​doi.org/​10.4071/​isom-2016-WP22.