Ultra Fine Pitch RDL Development in Multi-layer eWLB (embedded Wafer Level BGA) Packages

Won Kyoung Choi; Duk Ju Na; Kyaw Oo Aung; Andy Yong; Jaesik Lee; Urmi Ray; Riko Radojcic; Bernard Adams; Seung Wook Yoon

doi:10.4071/isom-2015-THP34

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Choi, Won Kyoung, Duk Ju Na, Kyaw Oo Aung, Andy Yong, Jaesik Lee, Urmi Ray, Riko Radojcic, Bernard Adams, and Seung Wook Yoon. 2015. “Ultra Fine Pitch RDL Development in Multi-Layer eWLB (Embedded Wafer Level BGA) Packages.” IMAPSource Proceedings 2015 (1): 822–26. https://doi.org/10.4071/isom-2015-THP34.

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