ISSN 2380-4505
Vol. 2019, Issue S2, 2019October 01, 2019 EDT
“Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration”
“Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration”
Articles in Vol. 2019, Issue S2, 2019
Vol. 2019, Issue S2, 2019
- SiP and ModuleRolf AschenbrennerKlaus PresselAndreas Grassmann
- Mobile TWGIMAPS symposium Proceedings and Conference Papers
- Recent Advances in Underfill MaterialsOSAMU SUZUKI
- Heterogeneous Integration for HPC and Data CentersKanad GhoseDale Becker
- “Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration”Yasuhiro Morikawa
- WLP TWGRozalia BeicaJohn Hunt
- Driving Force and Enabling Technology for Systems of the FutureWilliam Chen
Morikawa, Yasuhiro. 2019. “‘Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration.’” IMAPSource Proceedings 2019 (S2): S1–13. https://doi.org/10.4071/2380-4505-2019.1.InvitedAIHardware000001.