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ISSN 2380-4505
Symposium Proceedings
Vol. 2019, Issue S2, 2019October 01, 2019 EDT

“Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration”

Yasuhiro Morikawa,
Heterogeneous IntegrationPKGFan-outIC SubstrateSubstrate PatterningPCMTSVAI Hardware
https://doi.org/10.4071/2380-4505-2019.1.InvitedAIHardware000001
IMAPSource Conference Papers
Morikawa, Yasuhiro. 2019. “‘Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration.’” IMAPSource Proceedings 2019 (S2): S1–13. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.InvitedAIHardware000001.

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