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Symposium Proceedings
Vol. 2019, Issue S2, 2019
October 01, 2019 EDT
“Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration”
Yasuhiro Morikawa
,
Heterogeneous Integration
PKG
Fan-out
IC Substrate
Substrate Patterning
PCM
TSV
AI Hardware
•
https://doi.org/10.4071/2380-4505-2019.1.InvitedAIHardware000001
IMAPSource Conference Papers
Morikawa, Yasuhiro. 2019. “‘Manufacturing Technology Solution of Fan-out Packaging for Heterogeneous Integration.’”
IMAPSource Proceedings
2019 (S2): S1–13.
https://doi.org/10.4071/2380-4505-2019.1.InvitedAIHardware000001
.
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