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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures

Tatsushi Hayashi, Po Yu Lin, Ryoichi Watanabe, Seiko Ichikawa,
2.5D packagingbuild-up dielectrichigh crack resistancelow insertion loss
https://doi.org/10.4071/2380-4505-2020.1.000211
IMAPSource Conference Papers
Hayashi, Tatsushi, Po Yu Lin, Ryoichi Watanabe, and Seiko Ichikawa. 2020. “Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures.” IMAPSource Proceedings 2020 (1): 211–16. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000211.
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