Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment

Cong Zhao; Thomas Sanders; Zhou Hai; Chaobo Shen; John L. Evans

doi:10.4071/isom-2016-TP54

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Zhao, Cong, Thomas Sanders, Zhou Hai, Chaobo Shen, and John L. Evans. 2016. “Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment.” IMAPSource Proceedings 2016 (1): 117–22. https://doi.org/10.4071/isom-2016-TP54.

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