Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Study to Lower Cu Pillar Flip-Chip Failure Rate
Study to Lower Cu Pillar Flip-Chip Failure Rate
Rosario, Bong, Joseph Holyoak, Mohsen Haji-Rahim, Gene Lambird, Yong Wang, Kendra Lyons, Todd Johnson, Paul Makowenskyj, Brian Myers, and Shannon Pan. 2019. “Study to Lower Cu Pillar Flip-Chip Failure Rate.” IMAPSource Proceedings 2019 (1): 100–102. https://doi.org/10.4071/2380-4505-2019.1.000100.