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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging Technology

Christopher Kapusta, Liang Yin, Kaustubh Nagarkar, Anisha Walwaikar, Krishnaswami Srihari,
Power OverlayPOL-kWPackagingLight Emitting Diode (LED)Surface Mount Devices (SMD)flexiblepolyimideembedded packagesteady state thermal analysisIR tomography
https://doi.org/10.4071/2380-4505-2019.1.000306
IMAPSource Conference Papers
Kapusta, Christopher, Liang Yin, Kaustubh Nagarkar, Anisha Walwaikar, and Krishnaswami Srihari. 2019. “Thermal Modeling and Experimental Analysis of High Power LED Using POL-Kw Packaging Technology.” IMAPSource Proceedings 2019 (1): 306–11. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000306.
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