Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump

Chunyan Nan; Michael Mayer; Y. Norman Zhou; Jairus L. Pisigan; John Persic; Young-Kyu Song; Henry Bathan

doi:10.4071/isom-2010-WP4-Paper4

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Nan, Chunyan, Michael Mayer, Y. Norman Zhou, Jairus L. Pisigan, John Persic, Young-Kyu Song, and Henry Bathan. 2010. “Wire Bonding UPH and Stitch Bond Improvement Using 20 Micron Diameter Insulated Wire with Security Bump.” IMAPSource Proceedings 2010 (1): 667–74. https://doi.org/10.4071/isom-2010-WP4-Paper4.

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