Reliability analysis of low-Ag BGA solder joints using four failure criteria

Erin Kimura; Jianbiao Pan

doi:10.4071/isom-2012-TA24

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Kimura, Erin, and Jianbiao Pan. 2012. “Reliability Analysis of Low-Ag BGA Solder Joints Using Four Failure Criteria.” IMAPSource Proceedings 2012 (1): 66–72. https://doi.org/10.4071/isom-2012-TA24.

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