Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Advanced Build-up Materials and Processes for Packages with Fine Line and Space
Advanced Build-up Materials and Processes for Packages with Fine Line and Space
Nishimura, Yoshio, Hirohisa Narahashi, Shigeo Nakamura, and Tadahiko Yokota. 2014. “Advanced Build-up Materials and Processes for Packages with Fine Line and Space.” IMAPSource Proceedings 2014 (1): 444–47. https://doi.org/10.4071/isom-WA32.