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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Advanced Build-up Materials and Processes for Packages with Fine Line and Space

Yoshio Nishimura, Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota,
insulation build-up materialssemi-additive processlow dielectric loss tangentfine line
https://doi.org/10.4071/isom-WA32
IMAPSource Conference Papers
Nishimura, Yoshio, Hirohisa Narahashi, Shigeo Nakamura, and Tadahiko Yokota. 2014. “Advanced Build-up Materials and Processes for Packages with Fine Line and Space.” IMAPSource Proceedings 2014 (1): 444–47. https:/​/​doi.org/​10.4071/​isom-WA32.
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