Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:25512/feed
Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications

Catherine Shearer, Ken Holcomb,
Transient liquid phase sinteringsolder replacementhigh operating temperature interconnect
https://doi.org/10.4071/isom-2015-WP44
IMAPSource Conference Papers
Shearer, Catherine, and Ken Holcomb. 2015. “Transient Liquid Phase Sintering Pastes as Solder Alternatives in High Temperature Applications.” IMAPSource Proceedings 2015 (1): 453–58. https:/​/​doi.org/​10.4071/​isom-2015-WP44.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system