Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Impact of Grain Structure and Material Properties on Via Extrusion in 3-D Interconnects
Impact of Grain Structure and Material Properties on Via Extrusion in 3-D Interconnects
Jiang, Tengfei, Chenglin Wu, Jay Im, Rui Huang, and Paul S. Ho. 2014. “Impact of Grain Structure and Material Properties on Via Extrusion in 3-D Interconnects.” IMAPSource Proceedings 2014 (1): 8–12. https://doi.org/10.4071/isom-TA12.
Powered by Scholastica, the modern academic journal management system