Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling

Chaobo Shen; Cong Zhao; Zhou Hai; Jiawei Zhang; M. J. Bozack; J. C. Suhling; John L. Evans

doi:10.4071/isom-2015-TP52

Shen, Chaobo, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and John L. Evans. 2015. “Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling.” IMAPSource Proceedings 2015 (1): 135–40. https://doi.org/10.4071/isom-2015-TP52.

View more stats

Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling

This website uses cookies