Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling
Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling
Shen, Chaobo, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and John L. Evans. 2015. “Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling.” IMAPSource Proceedings 2015 (1): 135–40. https://doi.org/10.4071/isom-2015-TP52.