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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling

Chaobo Shen, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans,
Thermal agingSurface finishesSACENIGENIPIGIntermetallicCrack Propagation
https://doi.org/10.4071/isom-2015-TP52
IMAPSource Conference Papers
Shen, Chaobo, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack, J. C. Suhling, and John L. Evans. 2015. “Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling.” IMAPSource Proceedings 2015 (1): 135–40. https:/​/​doi.org/​10.4071/​isom-2015-TP52.
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