Novel Low Temperature Curable Photo-Patternable Polyamide with High Planarity for Wafer Level Fan-Out Packaging (WLFO)

Daniel Nawrocki; Andrew Cooper; Takanori Koizumi; Shinya Inagaki; Naoki Kawamoto; Nao Honda; Kristina Markt; Milton Bernal

doi:10.4071/2380-4505-2018.1.000483

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Nawrocki, Daniel, Andrew Cooper, Takanori Koizumi, Shinya Inagaki, Naoki Kawamoto, Nao Honda, Kristina Markt, and Milton Bernal. 2018. “Novel Low Temperature Curable Photo-Patternable Polyamide with High Planarity for Wafer Level Fan-Out Packaging (WLFO).” IMAPSource Proceedings 2018 (1): 483–87. https://doi.org/10.4071/2380-4505-2018.1.000483.

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