Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Novel Low Temperature Curable Photo-Patternable Polyamide with High Planarity for Wafer Level Fan-Out Packaging (WLFO)
Novel Low Temperature Curable Photo-Patternable Polyamide with High Planarity for Wafer Level Fan-Out Packaging (WLFO)
Nawrocki, Daniel, Andrew Cooper, Takanori Koizumi, Shinya Inagaki, Naoki Kawamoto, Nao Honda, Kristina Markt, and Milton Bernal. 2018. “Novel Low Temperature Curable Photo-Patternable Polyamide with High Planarity for Wafer Level Fan-Out Packaging (WLFO).” IMAPSource Proceedings 2018 (1): 483–87. https://doi.org/10.4071/2380-4505-2018.1.000483.