A study of Sub-micron Fan-out Wafer Level Packaging solutionsCanon

Yoshio GOTO; Kosuke URUSHIHARA; Bunsuke TAKESHITA; Ken-Ichiro MORI

doi:10.4071/2380-4505-2018.1.000488

Loading [Contrib]/a11y/accessibility-menu.js

GOTO, Yoshio, Kosuke URUSHIHARA, Bunsuke TAKESHITA, and Ken-Ichiro MORI. 2018. “A Study of Sub-Micron Fan-out Wafer Level Packaging solutionsCanon.” IMAPSource Proceedings 2018 (1): 488–93. https://doi.org/10.4071/2380-4505-2018.1.000488.

View more stats