Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Novel glass substrates for minimizing thermal stress development during electronic device packaging process
Novel glass substrates for minimizing thermal stress development during electronic device packaging process
Nomura, Shuhei, Shigeki Sawamura, Yu Hanawa, Yusuke Sakai, Kazutaka Hayashi, and Ltd. Asahi Glass Co. 2016. “Novel Glass Substrates for Minimizing Thermal Stress Development during Electronic Device Packaging Process.” IMAPSource Proceedings 2016 (1): 607–11. https://doi.org/10.4071/isom-2016-THP33.