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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

GHz High Frequency TSV for 2.5D IC Packaging

Chi-Han Chen, Kuan-Chung Lu, Chang-Ying Hung, Pao-Nan Lee, Meng-Jen Wang, Chih-Pin Hung, Ho-Ming Tong, Tzyy-Sheng Horng,
TSVThrough silicon via2.5D silicon interposerScalable modelReliability
https://doi.org/10.4071/isom-2012-THP62
IMAPSource Conference Papers
Chen, Chi-Han, Kuan-Chung Lu, Chang-Ying Hung, Pao-Nan Lee, Meng-Jen Wang, Chih-Pin Hung, Ho-Ming Tong, and Tzyy-Sheng Horng. 2012. “GHz High Frequency TSV for 2.5D IC Packaging.” IMAPSource Proceedings 2012 (1): 1215–20. https:/​/​doi.org/​10.4071/​isom-2012-THP62.
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