GHz High Frequency TSV for 2.5D IC Packaging

Chi-Han Chen; Kuan-Chung Lu; Chang-Ying Hung; Pao-Nan Lee; Meng-Jen Wang; Chih-Pin Hung; Ho-Ming Tong; Tzyy-Sheng Horng

doi:10.4071/isom-2012-THP62

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Chen, Chi-Han, Kuan-Chung Lu, Chang-Ying Hung, Pao-Nan Lee, Meng-Jen Wang, Chih-Pin Hung, Ho-Ming Tong, and Tzyy-Sheng Horng. 2012. “GHz High Frequency TSV for 2.5D IC Packaging.” IMAPSource Proceedings 2012 (1): 1215–20. https://doi.org/10.4071/isom-2012-THP62.

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GHz High Frequency TSV for 2.5D IC Packaging

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