GHz High Frequency TSV for 2.5D IC Packaging

Chen, Chi-Han, Kuan-Chung Lu, Chang-Ying Hung, Pao-Nan Lee, Meng-Jen Wang, Chih-Pin Hung, Ho-Ming Tong, and Tzyy-Sheng Horng. 2012. “GHz High Frequency TSV for 2.5D IC Packaging.” IMAPSource Proceedings 2012 (1): 1215–20. https:/​/​doi.org/​10.4071/​isom-2012-THP62.