Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration
Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration
Reed, Jason D., Matthew Lueck, Chris Gregory, Alan Huffman, John M. Lannon, and Dorota S. Temple. 2010. “Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration.” IMAPSource Proceedings 2010 (1): 28–35. https://doi.org/10.4071/isom-2010-TA1-Paper5.