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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

Jason D. Reed, Matthew Lueck, Chris Gregory, Alan Huffman, John M. Lannon, Dorota S. Temple,
3D IC thermocompression bonding high-density die-to-die interconnect
• https://doi.org/10.4071/isom-2010-TA1-Paper5
IMAPSource Conference Papers
Reed, Jason D., Matthew Lueck, Chris Gregory, Alan Huffman, John M. Lannon, and Dorota S. Temple. 2010. “Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration.” IMAPSource Proceedings 2010 (1): 28–35. https://doi.org/10.4071/isom-2010-TA1-Paper5.
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