Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

Jason D. Reed; Matthew Lueck; Chris Gregory; Alan Huffman; John M. Lannon; Dorota S. Temple

doi:10.4071/isom-2010-TA1-Paper5

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Reed, Jason D., Matthew Lueck, Chris Gregory, Alan Huffman, John M. Lannon, and Dorota S. Temple. 2010. “Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration.” IMAPSource Proceedings 2010 (1): 28–35. https://doi.org/10.4071/isom-2010-TA1-Paper5.

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