An Innovative High Thermal Conductive Solderable Adhesive | Published in IMAPSource Proceedings

IMAPSource Conference Papers

Liu, Mary, and Wusheng Yin. 2011. “An Innovative High Thermal Conductive Solderable Adhesive.” IMAPSource Proceedings 2011 (1): 852–56. https://doi.org/10.4071/isom-2011-WP6-PosterPapers-Paper2.

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