Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Assessment of XRF Technique as a Method to Measure Percent Ag in SnAg Solders for Flip Chip Applications
Assessment of XRF Technique as a Method to Measure Percent Ag in SnAg Solders for Flip Chip Applications
Schuler, Jennifer D, Chia-Hsin Shih, Charles L Arvin, KyungMoon Kim, and Eric Perfecto. 2012. “Assessment of XRF Technique as a Method to Measure Percent Ag in SnAg Solders for Flip Chip Applications.” IMAPSource Proceedings 2012 (1): 912–22. https://doi.org/10.4071/isom-2012-WP43.