Warpage Characterization and Improvements for IC Packages with Coreless Substrate

Bora Baloglu; Wei Lin; Ken Stratton; Miguel Jimarez; Danny Brady

doi:10.4071/isom-2013-TP25

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Baloglu, Bora, Wei Lin, Ken Stratton, Miguel Jimarez, and Danny Brady. 2013. “Warpage Characterization and Improvements for IC Packages with Coreless Substrate.” IMAPSource Proceedings 2013 (1): 260–64. https://doi.org/10.4071/isom-2013-TP25.

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