Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Warpage Characterization and Improvements for IC Packages with Coreless Substrate
Warpage Characterization and Improvements for IC Packages with Coreless Substrate
Baloglu, Bora, Wei Lin, Ken Stratton, Miguel Jimarez, and Danny Brady. 2013. “Warpage Characterization and Improvements for IC Packages with Coreless Substrate.” IMAPSource Proceedings 2013 (1): 260–64. https://doi.org/10.4071/isom-2013-TP25.