Vol. 2014, Issue 1, 2014January 01, 2014 EDT
SNaP: A Process for Achieving Adhesion between Electroless Copper and Dielectrics with Minimal Surface Roughening
SNaP: A Process for Achieving Adhesion between Electroless Copper and Dielectrics with Minimal Surface Roughening
Hsieh, Meng, Ellina Libman, and Lutz Brandt. 2014. “SNaP: A Process for Achieving Adhesion between Electroless Copper and Dielectrics with Minimal Surface Roughening.” IMAPSource Proceedings 2014 (1): 137–40. https://doi.org/10.4071/isom-TA54.