Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter

Rainer Dohle; Stefan Härter; Jörg Goßler; Jörg Franke

doi:10.4071/isom-2011-THA3-Paper5

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Dohle, Rainer, Stefan Härter, Jörg Goßler, and Jörg Franke. 2011. “Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 Μm Diameter.” IMAPSource Proceedings 2011 (1): 985–96. https://doi.org/10.4071/isom-2011-THA3-Paper5.

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