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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter

Rainer Dohle, Stefan Härter, Jörg Goßler, Jörg Franke,
Flip-chips accelerated life tests electromigration temperature cycling diffusion SnAgCu alloy
• https://doi.org/10.4071/isom-2011-THA3-Paper5
IMAPSource Conference Papers
Dohle, Rainer, Stefan Härter, Jörg Goßler, and Jörg Franke. 2011. “Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 Μm Diameter.” IMAPSource Proceedings 2011 (1): 985–96. https://doi.org/10.4071/isom-2011-THA3-Paper5.
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