Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter

Dohle, Rainer, Stefan Härter, Jörg Goßler, and Jörg Franke. 2011. “Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 Μm Diameter.” IMAPSource Proceedings 2011 (1): 985–96. https://doi.org/10.4071/isom-2011-THA3-Paper5.