Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter
Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter
Dohle, Rainer, Stefan Härter, Jörg Goßler, and Jörg Franke. 2011. “Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 Μm Diameter.” IMAPSource Proceedings 2011 (1): 985–96. https://doi.org/10.4071/isom-2011-THA3-Paper5.