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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 μm Diameter
Rainer Dohle
,
Stefan Härter
,
Jörg Goßler
,
Jörg Franke
,
Flip-chips
accelerated life tests
electromigration
temperature cycling
diffusion
SnAgCu alloy
•
https://doi.org/10.4071/isom-2011-THA3-Paper5
IMAPSource Conference Papers
Dohle, Rainer, Stefan Härter, Jörg Goßler, and Jörg Franke. 2011. “Accelerated Life Tests of Flip-Chips With Solder Bumps Down to 30 Μm Diameter.”
IMAPSource Proceedings
2011 (1): 985–96.
https://doi.org/10.4071/isom-2011-THA3-Paper5
.
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