Vol. 2014, Issue 1, 2014January 01, 2014 EDT
A New Approach for Reliable and Compact 3D Integration of mmW Transceivers on Silicon Using High-Impedance Surface Antennas
A New Approach for Reliable and Compact 3D Integration of mmW Transceivers on Silicon Using High-Impedance Surface Antennas
EL BOUAYADI, Ossama, Yann LAMY, Laurent DUSSOPT, and Brigitte SOULIER. 2014. “A New Approach for Reliable and Compact 3D Integration of mmW Transceivers on Silicon Using High-Impedance Surface Antennas.” IMAPSource Proceedings 2014 (1): 810–15. https://doi.org/10.4071/isom-THP21.
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