Vol. 2017, Issue 1, 2017October 01, 2017 EDT
Development of Thinner POP Base Package by Die Embedded and RDL Structure
Development of Thinner POP Base Package by Die Embedded and RDL Structure
Kyozuka, Masahiro, Takahiko Kiso, Hiroki Toyazaki, Koichi Tanaka, and Tetsuya Koyama. 2017. “Development of Thinner POP Base Package by Die Embedded and RDL Structure.” IMAPSource Proceedings 2017 (1): 715–20. https://doi.org/10.4071/isom-2017-THP31_028.