A TXV-less Packaging Platform for the Era of IoTs

Hu, Dyi-Chung, Yu-Min Lin, Hsiang Hung Chang, Tao-Chih Chang, Wei-Chung Lo, Chih-Kung Yang, Henry Yang, Yin-Po Hung, Yu-Hua Chen, and Ra-Min Tain. 2015. “A TXV-Less Packaging Platform for the Era of IoTs.” IMAPSource Proceedings 2015 (1): 1–5. https://doi.org/10.4071/isom-2015-TP14.