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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Characterization of Fine-Pitch Interconnections (≤ 10 μm) on Silicon Interconnect Fabric for Heterogeneous Integration
SivaChandra Jangam
,
Adeel Bajwa
,
Kannan K. Thankappan
,
Subramanian S. Iyer
,
Fine-Pitch Interconnections
Silicon Interconnect
Heterogeneous Integration
Si-IF
fine-pitch interconnects
inter-dielet spacing
direct metal-metal
thermal compression bonding
TCB
•
https://doi.org/10.4071/2380-4505-2018.1.000556
IMAPSource Conference Papers
Jangam, SivaChandra, Adeel Bajwa, Kannan K. Thankappan, and Subramanian S. Iyer. 2018. “Characterization of Fine-Pitch Interconnections (≤ 10 Μm) on Silicon Interconnect Fabric for Heterogeneous Integration.”
IMAPSource Proceedings
2018 (1): 556–60.
https://doi.org/10.4071/2380-4505-2018.1.000556
.
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