Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Characterization of Fine-Pitch Interconnections (≤ 10 μm) on Silicon Interconnect Fabric for Heterogeneous Integration
Characterization of Fine-Pitch Interconnections (≤ 10 μm) on Silicon Interconnect Fabric for Heterogeneous Integration
Jangam, SivaChandra, Adeel Bajwa, Kannan K. Thankappan, and Subramanian S. Iyer. 2018. “Characterization of Fine-Pitch Interconnections (≤ 10 Μm) on Silicon Interconnect Fabric for Heterogeneous Integration.” IMAPSource Proceedings 2018 (1): 556–60. https://doi.org/10.4071/2380-4505-2018.1.000556.
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