Vol. 2013, Issue 1, 2013January 01, 2013 EDT
An overview of molded underfill in flip chip packaging applications
An overview of molded underfill in flip chip packaging applications
Roa, Fernando. 2013. “An Overview of Molded Underfill in Flip Chip Packaging Applications.” IMAPSource Proceedings 2013 (1): 271–75. https://doi.org/10.4071/isom-2013-TP32.
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