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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Glass Based Inductors, Capacitors and System-In-Package for RF Applications
Jeb H Flemming
,
Roger Cook
,
Kyle McWethy
,
Glass
High-Q
Inductor
Packaging
Through Glass Vias
•
https://doi.org/10.4071/isom-2016-WP25
IMAPSource Conference Papers
Flemming, Jeb H, Roger Cook, and Kyle McWethy. 2016. “Glass Based Inductors, Capacitors and System-In-Package for RF Applications.”
IMAPSource Proceedings
2016 (1): 299–304.
https://doi.org/10.4071/isom-2016-WP25
.
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