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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
Thermal and Mechanical Characterization of High Power GaN Packages
Don Willis
,
Gary Gu
,
Daniel Jin
,
Rob Dry
,
electronic package
GaN devices
thermal performance
reliability
FEA
•
https://doi.org/10.4071/isom-2011-TP5-Paper2
IMAPSource Conference Papers
Willis, Don, Gary Gu, Daniel Jin, and Rob Dry. 2011. “Thermal and Mechanical Characterization of High Power GaN Packages.”
IMAPSource Proceedings
2011 (1): 361–66.
https://doi.org/10.4071/isom-2011-TP5-Paper2
.
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