Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Thermal and Mechanical Characterization of High Power GaN Packages
Thermal and Mechanical Characterization of High Power GaN Packages
Willis, Don, Gary Gu, Daniel Jin, and Rob Dry. 2011. “Thermal and Mechanical Characterization of High Power GaN Packages.” IMAPSource Proceedings 2011 (1): 361–66. https://doi.org/10.4071/isom-2011-TP5-Paper2.
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