This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:20455/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Investigation of electrical performance and mechanical reliability of device embedded power module

Masaya Tanaka, Keisuke Sawada, Toru Serizawa, Shuji Sagara,
device embedded moduleelectrical simulationreliability
https://doi.org/10.4071/isom-2012-TP63
IMAPSource Conference Papers
Tanaka, Masaya, Keisuke Sawada, Toru Serizawa, and Shuji Sagara. 2012. “Investigation of Electrical Performance and Mechanical Reliability of Device Embedded Power Module.” IMAPSource Proceedings 2012 (1): 473–81. https:/​/​doi.org/​10.4071/​isom-2012-TP63.

View more stats

Powered by Scholastica, the modern academic journal management system