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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Methodology for Predicting BGA Warpage by Incorporating Metal Layer Design
Sandeep Shantaram
,
Torsten Hauck
,
BGAs
composites
ECAD
MCAD
thermomechanical
warpage
•
https://doi.org/10.4071/isom-TA22
IMAPSource Conference Papers
Shantaram, Sandeep, and Torsten Hauck. 2014. “Methodology for Predicting BGA Warpage by Incorporating Metal Layer Design.”
IMAPSource Proceedings
2014 (1): 37–43.
https://doi.org/10.4071/isom-TA22
.
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