ISSN 2380-4505
Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Methodology for Predicting BGA Warpage by Incorporating Metal Layer Design
Methodology for Predicting BGA Warpage by Incorporating Metal Layer Design
Shantaram, Sandeep, and Torsten Hauck. 2014. “Methodology for Predicting BGA Warpage by Incorporating Metal Layer Design.” IMAPSource Proceedings 2014 (1): 37–43. https://doi.org/10.4071/isom-TA22.