Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)
Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)
J. H. Lau, C-J Zhan, P-J Tzeng, C-K Lee, M-J Dai, H-C Chien, Y-L Chao, W. Li, S-T Wu, J-F Hung, R-M Tain, C-H Lin, Y-C Hsin, C-C Chen, S-C Chen, C-Y Wu, J-C Chen, C-H Chien, C-W Chiang, H-H Chang, W-L Tsai, R-S Cheng, S-Y Huang, Y-M Lin, T-C Chang, C-D Ko, T-H Chen, S-S Sheu, S-H Wu, Y-H Chen, W-C Lo, T-K Ku, M-J Kao, D-Q Hu,
Lau, J. H., C-J Zhan, P-J Tzeng, C-K Lee, M-J Dai, H-C Chien, Y-L Chao, et al. 2011. “Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW).” IMAPSource Proceedings 2011 (1): 446–54. https://doi.org/10.4071/isom-2011-WA1-Paper1.
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