Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and Pads

Zheng Xu; Adam Beece; Kenneth Rose; Jian-Qiang Lu

doi:10.4071/isom-2010-TP1-Paper1

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Xu, Zheng, Adam Beece, Kenneth Rose, and Jian-Qiang Lu. 2010. “Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and Pads.” IMAPSource Proceedings 2010 (1): 164–69. https://doi.org/10.4071/isom-2010-TP1-Paper1.

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