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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and Pads
Zheng Xu
,
Adam Beece
,
Kenneth Rose
,
Jian-Qiang Lu
,
3D
Through-strata-via (TSV)
Pads
Electrical Modeling
•
https://doi.org/10.4071/isom-2010-TP1-Paper1
IMAPSource Conference Papers
Xu, Zheng, Adam Beece, Kenneth Rose, and Jian-Qiang Lu. 2010. “Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and Pads.”
IMAPSource Proceedings
2010 (1): 164–69.
https://doi.org/10.4071/isom-2010-TP1-Paper1
.
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