Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and Pads
Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and Pads
Xu, Zheng, Adam Beece, Kenneth Rose, and Jian-Qiang Lu. 2010. “Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and Pads.” IMAPSource Proceedings 2010 (1): 164–69. https://doi.org/10.4071/isom-2010-TP1-Paper1.