Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Modeling in the Cloud: Web Hosted CPI Modeling for Fabless Design Houses and OSATs Method for Mechanical Stress Simulation across the Chip & Package Domains in 3D IC’s
Modeling in the Cloud: Web Hosted CPI Modeling for Fabless Design Houses and OSATs Method for Mechanical Stress Simulation across the Chip & Package Domains in 3D IC’s
Nakamoto, Mark, Karthikeyan Dhandapani, Wei Zhao, Ahmer Syed, Wei Lin, and Riko Radojcic. 2012. “Modeling in the Cloud: Web Hosted CPI Modeling for Fabless Design Houses and OSATs Method for Mechanical Stress Simulation across the Chip & Package Domains in 3D IC’s.” IMAPSource Proceedings 2012 (1): 1026–33. https://doi.org/10.4071/isom-2012-THP12.
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