Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC Integration
Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC Integration
J. H. Lau, P-J Tzeng, C-K Lee, C-J Zhan, M-J Dai, Li Li, C-T Ko, S-W Chen, H. Fu, Y. Lee, Z. Hsiao, J. Huang, W. Tsai, P. Chang, S. Chung, Y. Hsu, S-C Chen, Y-H Chen, T-H Chen, W-C Lo, T-K Ku, M-J Kao, J. Xue, M. Brillhart,
Lau, J. H., P-J Tzeng, C-K Lee, C-J Zhan, M-J Dai, Li Li, C-T Ko, et al. 2011. “Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) Wafer for 3D IC Integration.” IMAPSource Proceedings 2011 (1): 650–56. https://doi.org/10.4071/isom-2011-WA6-Paper2.
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