Lau, J. H., P-J Tzeng, C-K Lee, C-J Zhan, M-J Dai, Li Li, C-T Ko, et al. 2011. “Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) Wafer for 3D IC Integration.”
IMAPSource Proceedings 2011 (1): 650–56.
https://doi.org/10.4071/isom-2011-WA6-Paper2.