Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.

Kiran Vanam; Anthony Newman; Mori Poustinchi; Stephen Stewart

doi:10.4071/isom-WA61

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Vanam, Kiran, Anthony Newman, Mori Poustinchi, and Stephen Stewart. 2014. “Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.” IMAPSource Proceedings 2014 (1): 533–36. https://doi.org/10.4071/isom-WA61.

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