Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.
Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.
Vanam, Kiran, Anthony Newman, Mori Poustinchi, and Stephen Stewart. 2014. “Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.” IMAPSource Proceedings 2014 (1): 533–36. https://doi.org/10.4071/isom-WA61.