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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.

Kiran Vanam, Anthony Newman, Mori Poustinchi, Stephen Stewart,
Bare Die PackageFlip Chip Ball Grid ArrayHigh Volume ManufacturingOriginal Equipment ManufacturerOutgoing Quality Assurance and Package on Package
https://doi.org/10.4071/isom-WA61
IMAPSource Conference Papers
Vanam, Kiran, Anthony Newman, Mori Poustinchi, and Stephen Stewart. 2014. “Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.” IMAPSource Proceedings 2014 (1): 533–36. https:/​/​doi.org/​10.4071/​isom-WA61.
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