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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.

Kiran Vanam, Anthony Newman, Mori Poustinchi, Stephen Stewart,
Bare Die Package Flip Chip Ball Grid Array High Volume Manufacturing Original Equipment Manufacturer Outgoing Quality Assurance and Package on Package
• https://doi.org/10.4071/isom-WA61
IMAPSource Conference Papers
Vanam, Kiran, Anthony Newman, Mori Poustinchi, and Stephen Stewart. 2014. “Quality Monitors and Inspection Criteria for Bare Die Flip Chip Ball Grid Array and Bare Die PoP Packages.” IMAPSource Proceedings 2014 (1): 533–36. https://doi.org/10.4071/isom-WA61.
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