Hermetic Seal Bonding at Low-temperature with Sub-micron Gold Particles for Wafer Level Packaging

Ogashiwa, Toshinori, Kentaro Totsu, Mitsutomo Nishizawa, Hiroyuki Ishida, Yuya Sasaki, Masayuki Miyairi, Hiroshi Murai, Yukio Kanehira, Shuji Tanaka, and Masayoshi Esashi. 2015. “Hermetic Seal Bonding at Low-Temperature with Sub-Micron Gold Particles for Wafer Level Packaging.” IMAPSource Proceedings 2015 (1): 73–78. https://doi.org/10.4071/isom-2015-TP32.