Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging
Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging
Lee, Alvin, Jay Su, Baron Huang, Ram Trichur, Dongshun Bai, Xiao Liu, Wen-Wei Shen, et al. 2016. “Optimization of Laser Release Layer, Glass Carrier, and Organic Build-up Layer to Enable RDL-First Fan-out Wafer-Level Packaging.” IMAPSource Proceedings 2016 (1): 190–95. https://doi.org/10.4071/isom-2016-WA34.