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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Advanced wire bonding for high reliability and high temperature applications

M. Guyenot, M. Reinold, Y. Maniar, M. Rittner,
Active power cycling high temperature joining reliability ribbon bonding WBG wire bonding
• https://doi.org/10.4071/isom-2016-WA51
IMAPSource Conference Papers
Guyenot, M., M. Reinold, Y. Maniar, and M. Rittner. 2016. “Advanced Wire Bonding for High Reliability and High Temperature Applications.” IMAPSource Proceedings 2016 (1): 214–18. https://doi.org/10.4071/isom-2016-WA51.
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