Advanced wire bonding for high reliability and high temperature applications

M. Guyenot; M. Reinold; Y. Maniar; M. Rittner

doi:10.4071/isom-2016-WA51

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Guyenot, M., M. Reinold, Y. Maniar, and M. Rittner. 2016. “Advanced Wire Bonding for High Reliability and High Temperature Applications.” IMAPSource Proceedings 2016 (1): 214–18. https://doi.org/10.4071/isom-2016-WA51.

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