Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Advanced wire bonding for high reliability and high temperature applications
Advanced wire bonding for high reliability and high temperature applications
Guyenot, M., M. Reinold, Y. Maniar, and M. Rittner. 2016. “Advanced Wire Bonding for High Reliability and High Temperature Applications.” IMAPSource Proceedings 2016 (1): 214–18. https://doi.org/10.4071/isom-2016-WA51.